Epiel JSC presents 200mm silicon epitaxial wafers for power electronics

RUSSIA: As the global power electronics industry is shifting production from 150 to 200 mm substrates, Epiel JSC introduces to the market 200 mm silicon epitaxial wafers for discrete power devices.

According to industry analysts, power electronics is likely to remain one of the most attractive sectors of semiconductor market in the next few years. Energy efficiency is gaining more and more emphasis in areas such as hybrid vehicles, industrial motor drives and PV-inverters for solar power systems.

The energy efficiency boom drives sales of power semiconductors since they are widely used to help reduce energy losses and improve efficiency. This in turn increases demand for silicon epitaxial wafers which serve as initial material for power semiconductors manufacturing.

"While new materials such as GaN and SiC are now drawing attention of manufacturers, silicon epitaxial wafers still remain the core material for power semiconductors production due to low cost and reliability," said Epiel's CEO Vladimir Statsenko. "The promising GaN and SiC are not yet ready for industrial application. There are technological challenges and cost issues yet to overcome before these new materials can reach the mass market."

Amid the growing demand, shifting production from 150 to 200 mm substrates will help power semiconductor manufacturers increase efficiency and gain competitive advantage. In this context the supply of high quality 200 mm silicon epitaxial wafers for power devices is likely to become one of the key success factors.