Monday, January 7, 2013

Fairchild's Dual Cool package improves power density and performance in DC-DC power apps

USA: Designers of DC-DC conversion applications are challenged with improving power density while saving board space and reducing thermal resistance.

Fairchild Semiconductor’s new mid-voltage PowerTrench MOSFETs with Dual Cool packaging technology are well suited to help with these design challenges.

Fairchild has expanded and improved its Dual Cool packaging portfolio, an industry-standard pin-out package with top-side cooling, to include a 40-100V mid-voltage series. Silicon technology advancements, paired with the Dual Cool technology, provide excellent switching performance as well as low junction-to-ambient thermal resistance that is four times less than the standard over-molded 5mm x 6mm MLP.

Devices included in the mid-voltage series include the 40V FDMS8320LDC, 60V FDMS86500DC, 80V FDMS86300DC and the 100V FDMS86101DC. These devices are synchronous rectifying MOSFETs that are suitable for use in DC-DC converters, telecom secondary-side rectification and high-end server/workstation applications.

All devices in this product family are available in a PQFN 5x6 8L package and are priced at:

• FDMS8320LDC (40V): $1.09
• FDMS86500DC (60V): $1.16
• FDMS86300DC (80V): $1.16
• FDMS86101DC (100V): $1.09.

Dual Cool packaged MOSFETs are part of Fairchild's industry-leading MOSFET portfolio. By understanding the demands for higher current DC-DC power supplies in smaller footprints for space constrained applications, as well as our customers and the markets they serve, Fairchild can tailor its unique combination of functional, process and packaging innovation into solutions that make a difference in electronic designs.

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