ST first to use through-silicon vias for smaller and smarter MEMS chips

GENEVA, SWITZERLAND: STMicroelectronics is the world's first manufacturer to have implemented Through-Silicon Via technology (TSV) in high-volume MEMS production. TSV replaces traditional wiring with short vertical interconnects in ST's multi-chip MEMS devices, such as smart sensors and multi-axis inertial modules, enabling a higher level of functional integration and performance in a smaller form factor.

TSV utilizes short, vertical structures to connect multiple silicon dice stacked vertically in a single package, offering greater space efficiency and higher interconnect density compared with wire bonding or flip chip stacking. Already deployed in volume production, the ST-patented TSV technology helps shrink the MEMS chip size while increasing its robustness and performance.

"There is a great demand for smaller packages in the consumer market. ST's breakthrough implementation of TSV in MEMS devices opens a path to reduced footprints and increased functionality in mobile phones and other gadgets," said Benedetto Vigna, corporate VP and GM of ST's Analog, MEMS and Sensor Group. "High-performance 3D-chip integration in our smart sensors and multi-axis inertial modules marks another important milestone in our mission to make MEMS ubiquitous in all facets of life."

STMicroelectronics has a long history and expertise in high-volume production of MEMS sensors and actuators. Five years ago, ST launched the Consumer MEMS revolution by making motion sensors small, accurate and affordable through the combination of innovative product design, deep application expertise, and bold and timely infrastructure investments. More than 1.6 billion ST's MEMS chips has been sold to date, addressing applications in Consumer, Computer, Automotive, Industrial and Medical segments.