Friday, September 30, 2011

SPTS ships 600th AVP vertical thermal processing system

SAN JOSE, USA: SPTS Technologies, a leading manufacturer of etch, deposition, and thermal processing equipment for the semiconductor and related industries today announced the shipment of its 600th Advanced Vertical Processor (AVP) vertical batch thermal processing system to Cypress Semiconductor Corp.. The system will be used for Cypress's S8 technology platform, which supports Cypress's TrueTouch, PSoC 3, PSoC 5, CapSense and NVSRAM products.

Manufactured at SPTS' Thermal Products Division in San Jose, Calif., the AVP furnace is used for a diverse range of diffusion and low-pressure chemical vapor deposition (LPCVD) applications in the semiconductor, power management, MEMS and compound semiconductor markets. The division maintains development capability on the common wafer sizes for all these markets, from 100 to 300mm.

The AVP is available in a single or dual-boat configuration, providing flexibility and a low CoO solution for all process types. In-situ clean technology enables the AVP to run LPCVD processes for up to two years between quartz change, significantly improving the system uptime and maximizing productivity. Key processes include wafer annealing from 100°C to >1,200°C and the deposition of low-temperature SiGe, thick doped polysilicon and stress-controlled SiN.

"SPTS is a key partner in enabling our high-performance Silicon-Oxide-Nitride-Oxide-Silicon (SONOS) technology," said Shahin Sharifzadeh, executive VP of Cypress. "Its expertise in thermal processing technology and commitment to customer service are invaluable in helping us to deliver our products to market."

"We are very pleased to have made this milestone shipment to Cypress," said Vivek Rao, VP and GM of SPTS Thermal Products Division. "This shipment demonstrates both the success of the AVP product line and pays testament to the strong partnerships we develop with our customers."

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