Vitesse enables scalable, high-density 10G/40G/100G communication systems

SANTA CLARA, USA: Vitesse Semiconductor Corp. has announced the immediate availability of the VSC8248 Quad Interconnect IC.

The device has four Clock and Data Recovery (CDR) channels with integrated Electronic Dispersion Compensation (EDC), four integrated transmit channels, and control circuitry for managing downstream modules. This IC provides high-performance, high-density signal connectivity that enables customers to increase capacity for Storage, Server, Router, or Optical Transport Equipment.

Whether transporting traffic across a backplane, a line card, an optical fiber, or a copper cable, the VSC8248 provides superior signal integrity, speed flexibility ranging from 1 Gbps to 11.3 Gbps, integrated diagnostics for remote monitoring, fault isolation, and scalability to over 100,000 ports.

Increased bandwidth requirements are driving transitions to higher speeds and greater port densities supporting new standards including 10, 40, and 100 Gigabit Ethernet as well as 8 and 16 Gigabit Fibre Channel. To meet these demanding requirements, new communication systems and modules are implemented in highly parallel 4x10G, 10x10G, and 10x12G architectures.

These new architectures require converged features demanding a wide range of data rates and protocols in the same chassis. Supported by Vitesse’s industry-best FlexEQ EDC capabilities, advanced VScope remote waveform viewing technology, an extensive suite of self test (BIST) functions, and low jitter, fully-compliant 10G BASE-KR output drivers, the VSC8248 is an ideal device for providing improved signal integrity in converged parallel applications.

“The newest members of the celebrated FlexEQ-based product family deliver compelling blends of features and functionality to meet the stringent requirements of the SFP+ and next-generation and legacy backplane markets,” said Gary Paules, product marketing manager for Vitesse. “The superior capabilities of the VSC8248 solidify Vitesse’s performance lead across a number of applications while supporting the market trends toward higher density, converged protocols, and lower cost.”