Microsemi announces space-saving SmartFusion cSoC devices

ALISO VIEJO, USA: Microsemi Corp. announced its award-winning SmartFusion customizable system-on-chip (cSoC) family is now available in a "CS288" 288-ball chip scale package (CSP) package.

The new small footprint package is designed for a wide range of industrial, military, communications, medical and computational applications such as security cameras, advanced weapon systems, wearable power supplies, optical transponders, flow monitors, oral x-ray sensors, remote heart monitors and single board computers.

"In today's marketplace, the need for small, thin and lightweight packaging has expanded into industrial and communications applications," said Rich Kapusta, VP of marketing, SoC Products Group at Microsemi. "The new CS288 package offers exactly that along with a high number of user I/Os, making it ideal for small form-factor embedded systems across a number of industries. We look forward to continuing the expansion of our product offerings to ensure we provide our customers with the innovative embedded solutions they need."

Key features include:
* Small 11x11 mm square and only 1.05 mm in height.
* Available in leaded & lead-free (RoHS compliant) packages.
* Available in commercial and industrial temperature grades.
* Available across all densities enabling future proofing of designs.
* 135 user IOs including FPGA, microcontroller GPIO and analog I/Os.
* 10/100 Ethernet, external memory controller, with I2C, SPI and UART interfaces.
* A complete 100 MHz ARM Cortex-M3 32-bit microcontroller sub-system with up to 500K gates of FPGA and feature rich programmable analog.