MINNEAPOLIS, USA: FSI International Inc., a leading manufacturer of surface conditioning equipment for microelectronics manufacturing, announced that it received orders for multiple ANTARES Cryokinetic cleaning systems.
The logic and foundry chip providers that placed these orders currently use the ANTARES system for various BEOL particle removal processes including particle removal after in-line wafer testing and other high defectivity steps to focus on improving overall device yield. Unlike aqueous technologies, Cryokinetic cleaning technology is uniquely qualified for these applications because of its all-dry defect removal method. FSI has over 150 ANTARES process modules in production at foundry and logic device producers worldwide. The systems are expected to ship in the second half of fiscal 2011.
The ANTARES system is a fully automated, single-wafer, Cryokinetic product used for processing 200/300mm wafers with capabilities to remove nanoscale particles. Cryokinetic processing technology is an all-dry, non-reactive process that removes particles through impact by high-velocity cryogenic Ar/N2 aerosol, and reduces defects without damaging the wafer surface, even on copper and porous low-k films.
The system’s highly efficient dry cleaning solution can be used for a variety of particle removal applications in FEOL and BEOL. Many of the leading logic device manufacturers worldwide utilize the ANTARES system for its defect reduction and yield improvement benefits.