ST IPAD technology shrinks and simplifies protection for high-bandwidth connections

INDIA: STMicroelectronics has unveiled a new IC enabling manufacturers to reduce parts count and simplify the design of reliable, high-speed data circuits commonly used in smartphones, tablets and mobile computers, as well as for wired connections such as USB2.0 and HDMI. ST is the global leader in the Integrated Passive and Active Devices (IPAD) technology enabling these new devices.

The ECMF02 and ECMF04 are the industry’s first silicon-based ICs to combine the common-mode filtering and ESD protection needed by high-speed data lines. Common-mode filtering prevents data errors caused by electromagnetic interference (EMI), and is usually implemented using a separate ceramic-type component. ST’s new devices enable a cost-effective single-chip solution saving printed-circuit-board (PCB) space and simplifying design and assembly.

ST currently supplies more than 30 percent of all IPAD components worldwide and has patented a new filter topology to realize the Common-Mode Filter (CMF) in silicon. This represents a technical breakthrough that will save up to 50 percent of the PCB space typically needed to implement the CMF and ESD protection separately. The devices are also only 0.55mm high, which will help designers create ultra-slimline products.

Major features:
* ECMF02 – single-channel device.
* ECMF04 – two data-channel device.
* 6GHz differential bandwidth, complies with HDMI, MIPI D-PHY and USB2.0.
* High common-mode attenuation:
x -34dB at 900MHz
x -20dB between 800MHz and 2.2GHz
* High ESD protection with low remaining voltage (Vpeak < 50V).
* Flow-through pin-out enabling efficient, simplified PCB layout.

The devices are available immediately for quantities of 5000 pieces, priced at $0.18 for the ECMF02-2AMX6 (6-lead uQFN package) and $0.36 for the ECMF04-4AMX12 (12-lead uQFN). Alternative pricing options are available for larger quantities.