SiliconBlue ships highest logic capacity FPGA in 6x6 mm footprint package

SANTA CLARA, USA: SiliconBlue Technologies, a leading provider of custom mobile devices for consumer handset applications, announced the immediate availability of two new device packages for its iCE65 mobileFPGA family.

The iCE65L01 device with 1,280 logic cells is now offered in a 5x5 mm, 81-ball BGA package with 63 user I/O pins, and the iCE65P04 device with 3,520 logic cells is now offered in a 6x6 mm, 121-ball BGA package with 95 user I/O pins.

Today’s mobile designers face a daunting challenge. They must deliver a new mobile handset with innovative and differentiating features every year. Unfortunately, today’s application processors take approximately 2-3 years to develop and may still not include the functions the designer needs.

In addition, these new features require plentiful logic coupled with additional I/O, which the application processor may not offer. By using SiliconBlue’s iCE65 mobileFPGA devices, designers can add new features to their mobile handset by complementing their existing applications processor, enabling fast innovation in the highly competitive mobile market.

Kapil Shankar, CEO of SiliconBlue said: “Our experience with the mobile handset market has taught us that in order to implement feature-rich functions, designers often need high logic capacity and maximum I/O, all in a small footprint package. These new devices, along with our wildly successful wafer-level chip scale packages are in demand for implementing a number of features including gyros, accelerometers, and dual displays.”

The iCE65L01F-TCB81 and the iCE65P04F-TCB121 are available immediately in volume production.