SEATTLE, USA: MPC Data, a Gold-level member of the Microsoft Windows Embedded Partner Program, announced the release to the market of a range of Microsoft Windows Embedded CE 6.0 R3 Board Support Packages (BSPs).
These new BSPs are available for Texas Instruments Incorporated (TI) OMAP-L137, OMAP-L138, and Sitara ARM®9 AM18x and AM17x processors and evaluation modules (EVMs).
TI's OMAP-L1x devices are a range of low-power applications processors based on an ARM926EJ-S and the TMS320C674x DSP core, which is significantly lower power than other members of the C6000 DSP platform. The multi-core architecture of the device family provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies.
TI's ARM-only Sitara AM17x and AM18x families of devices share a common ARM926EJ-S core and rich peripheral set with the OMAP-L1x devices, offering the same high performance and low power benefits but without a C674x DSP core.
The BSPs, with integrated device drivers for all standard interfaces available on the EVMs, enable application developers to port their Windows Embedded CE-based software onto the EVMs with minimal development effort and risk.
MPC Data's BSPs are the key starting point for OEMs developing differentiated Windows Embedded CE-based devices with rich user experiences and streamlined connectivity to Windows PCs, servers and online services. The BSPs offer a robust solution for OEMs needing to have a complete Windows Embedded CE solution up and running as quickly as possible.
In addition to the range of BSPs, MPC Data has worked with TI to provide a full online support infrastructure, allowing customers not only to download the BSPs but also gain access free online support and user forums during their evaluation period.
Wednesday, August 25, 2010
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