Ultratech receives follow-on order for TSV applications

SAN JOSE, USA: Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices, has received a follow-on order for its AP200 lithography system, which features an innovative dual-side alignment (DSA) system for through-silicon via (TSV) applications.

Built on its customizable Unity Platform, Ultratech's systems are the exclusive tool of record at this customer's facility--one of the first Japanese companies to enter into volume production of image sensors.

According to Jan Vardaman, president and founder of TechSearch International: "The level of TSV activity in the last few quarters has increased dramatically. Today, image sensors with TSVs are shipping in high volume for cameras in mobile phones. The next target for mobile phones is memory and processor applications. By the year 2012, millions of wafers will ship with TSVs."

"This follow-on order validates the technology leadership and economic value associated with the use of steppers for via last TSV applications," said Manish Ranjan, director of product marketing for advanced packaging at Ultratech.

"The increasing importance of packaging technology for the TSV market is exciting for the entire supply chain and Ultratech, as a market leader, is well positioned to gain from the continued adoption of TSV technology. We look forward to working closely with this valued customer and providing lithography systems that are cost-effective and extendible for multiple generations."