NEW YORK, USA: Reportlinker.com announced that a new market research report is available in its catalog: Current Development of Leading Chinese IC Design Houses.
In 2008, the output of the Chinese IC design industry reached 23.52 million RMB (approx. $3.44 billion), growing 4.2 percent compared to 2007. This growth rate was significantly below the 21.2 percent growth rate in 2007.
The top-10 ranking of IC design houses in China changed considerably in 2008. Hisilicon experienced large revenue increases and took over first place. Companies ranked second to tenth experienced different degrees of revenue decline. This report offers multi-faceted analysis of the leading IC design houses in China, including their revenue, product development, and cooperation with other companies.
Companies and organizations analyzed or mentioned in the report include:
Alvic Technology, Amkor, Amoi, ANST, ANV Security Group, ARM, ASE, ASMC, BBK, BenQ, Beta Power Tech, Bird, Cadence, Cadrado, CEC Huada Electronic Design, CEC Telecom, CECW, Ceva, Changhong, Changjiang Electronics Technology, China Aerospace Science & Industry Group, China Construction Bank, China Huajing Eelectronics Group, China Integrated Circuit Design, China Mobile, China Resources Group, China Resources Microelectronics, China Telecom, China Unicom, Chongqing Chongyou Information Technology, CMPAK, Comsys, Crearo Technology, CSMC Technologies, Datang, Datang Microelectronics, DBTel, Denvel, Dilithium Networks, Disney, Eastele Technology, ESS, Excelpoint International, Foxshare, Fujitsu, G.M.I. Technology, Ginwave, Gohigh Data Networks Technology, Great Wall Computer, GSMC, Guanghuida, Haier, Hangzhou Gold Information Technology, Hedy, HeJian Technology, Hisense, Hiteker Company, Hong Kong Beta Power Tech, Hongjing Microelectronics, Huada Hengtai Technology, Huada Test, Huada Zhibao, Huahong Integrated Circuit, Huahong NEC, HuahongJt Smart Card System, Huaming Technology, Huawei, Hyundai, IC Design Center of China Academy of Telecommunications Technology, IMBTVN, Industrial and Commercial Bank of China, Infineon, Institute of Microelectronics of Tsinghua University, Intech, Interine, Inventec, Irico, Irico-Aotom, Jess Technology, Konka, Launch Digital Technology, Lenovo, Lestina International, Malata, Mavrix Technology (Shanghai), Mediatek, Ministry of Public Security, MIPS Tech, Mitzuv, Nanjing Micro One Electronics, Nanker Group, Nantong Fujitsu Microelectronics, Nationz Technologies, NEC, Newman, Nintaus, Onda, Paragon IC Solutions, Real Networks, Renesas, ROHM, RThitech, Semico, Shanghai Belling, Shanghai DuPont, Shanghai Fudan Hi-tech Company, Shanghai Institute of Microsystem and Information Technology, Shenzhen Hongtaili Technology, Shenzhen Huanghe Digital Technology, Shenzhen MPR Times Technology, Shenzhen Salan Microelectronics, Shenzhen Skyrise Technology, Shenzhen Streaming Video Technology, Shigang Technology, Shinco, Shougang NEC, Sicomm Technology, Silan Azure, Silan Integrated Circuit, Silan Microelectronics, Sino-Microelectronics, Skyworth, SMIC, Solomon Systech, SPIL, SRS Labs, State Development & Investment Corporation, Sunnic, Sunplus Technology, Synopsys, TCL, Thomson, Tianshui Huatian Microelectronics, Tianyu, Tongfang Microelectronics, Topwise, Tsinghua Tongfang, Tsinghua University, TSMC, UDTech, UNIS Technology (Beijing), VeriSilicon, Vimicro, Wingtech, Xinwei, Xinyoutong, Xundu, Yifang Technology, Zhejiang University, ZTE