NEW DELHI, INDIA: STMicroelectronics will demonstrate its world-class solutions at SmartCards Expo, the international exhibition and conference on smartcard technology and applications under the theme “Defining the Smartcard World.” ST’s secure microcontroller portfolio covers the broad range of mobile and secure applications, offering compliance with the latest security standards and many interfaces for both contact and contactless communication.
Among the highlights at the ST booth are:
ST has developed a complete range of highly secure smartcard ICs that cover every aspect of large-scale, government-level programs, including national ID, passport, national health, driving license, and registered-traveler projects. Based on advanced 0.13µm and 90nm EEPROM technologies, ST’s ID/Passport chips support specific requirements for security (EAL6+), reliability, speed and interoperability. The devices have proven their value in deployments in a number of government projects around the world. For the local market, the chips being displayed are also compliant with the Indian Smart-Card Operating System (SCOSTA).
Designed for highly secure applications, the ST23 platform is the perfect choice for banking smartcards. A broad product range including contact and contactless products, for SDA or DDA applications, provides outstanding flexibility and security. The ST23 platform is already widely adopted in banking across the world and has been certified by EMVCo, Common Criteria (EAL5+ /EAL6+) and ZKA. Initially based on advanced 0.13μm technology, the ST23 platform is migrating to the latest 90nm EEPROM technology, providing enhanced performance and security at an optimized cost.
Near-field communication (NFC)
ST offers a ready-to-use solution with full embedded firmware covering all the contact interfaces to the terminal processor, (U)SIM and all other secure elements. It also includes the drivers for all RF standard interfaces, and provides a flexible and open solution for a market in evolution by integrating a microcontroller and embedded non-volatile memory which allows an efficient and easy upgrade of the firmware and user functions.
With the various embedded connectivity channels, the ST21NFCA is able to address different phone or contactless-device system architectures. In addition, the ST21NFCA is based on field-proven and cost-optimized 0.13μm EEPROM technology to achieve a very small footprint.
A demo will highlight ST’s industry-unique and innovative dual-interface EEPROM. The device enables quick and easy contactless reading and writing in a wide variety of applications, including diagnostics, parameter update, remote activation and asset tracking across the Consumer, Industrial, Medical and Automotive fields.
Established more than 20 years ago, ST India has grown to become an important industry leader with an in-depth knowledge of the local market.
The breadth of R&D and product-design activities carried out by ST in India reflects the exceptional ability of India’s engineers to create industry-leading solutions; ST’s Design Center at Greater Noida is the Company’s largest center outside of Europe. With its long-standing and strong presence, ST is well positioned to be a strategic partner for any large-scale smartcard deployment project in India.
ST will also present a session on ‘Advanced IC Solutions and Architecture in NFC Mobile Payment’ by Bruno Batut on September 21, 2011 in the conference associated with the exhibition.