NORTH READING, USA: Teradyne's Global Service Organization (GSO) and Evans Analytical Group (EAG) introduced Silicon Release Solutions (SRS), a new solution offering a complete and comprehensive set of full vertical engineering services and pilot production for emerging fabless semiconductor companies. SRS has multiple customers across several semiconductor markets.
"An increasing amount of specialized engineering skills are needed to bring a chip to market. Chips are more complex, higher parallelism is required to hit cost targets and specialized equipment is needed to get the job done," said Chris Giovanniello, SRS product manager, Teradyne. "As start-up players in the semiconductor IC market, emerging fabless companies face significant obstacles getting their product to market. We wanted to address as many of those challenges as possible, and thus Silicon Release Solutions was established."
Silicon Release Solutions helps companies manage their multi-vendor supply chain from wafer management to release-to-production, ensuring access to the necessary equipment for high-volume manufacturing, and providing highly-skilled engineers, just when they’re needed. For start-up companies, being able to count on an outsource partner like Silicon Release Solutions means reducing risk and ensuring that new products get into the market on time.
“Combining the world’s most extensive test engineering network from Teradyne and the world’s largest independent semiconductor analytical lab from EAG is a truly unique combination that delivers significant value to fabless semiconductor companies," said Aram Sarkissian, vice president of Sales, EAG. "We strive to add value during each step of the development and manufacturing process, and customers are benefiting from that through reduced risk and improved time-to-market performance.”
Tuesday, July 12, 2011
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