IRVINE, USA: Microsemi Corp., a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, has announced a new multichip (MCP) memory product that provides a drop-in replacement for the discontinued Micron memory package used in Texas Instruments (TI) processors.
The MS29C2G24MAKLA1-XI is the first in a family of planned products, and is available today. The new memory solution is compatible with TI processor families that are enclosed in Micron Technology's end-of-life (EOL) package-on-package (PoP) 152-pin ball grid array (BGA). The Microsemi replacement package allows users to avoid time-consuming board redesign efforts and protect current design-wins.
The new Microsemi component family is compatible with TI's Sitara, OMAP, and DaVinci processors. The initial product has the same footprint as Micron's MT29C2G24MAKLACG-XIT, providing a replacement for the EOL package. Additional features include LPDDR and LPDDR+ flash and are specifically designed to support TI OMAP35xx, AM37x and DM37x processors.
Key features
* Extends the life of memory devices in the 152BGA package currently EOL by Micron; provides same form, fit and function.
* Avoids the need for PCB redesign and protects established design wins.
* Supports TI processors that employs the use of a PoP memory support chip.
Microsemi's MS29C2G24MAKLA1-XI (OMAP MCP) memory houses 2G (x16) SLC NAND Flash and 1G (x32) Mobile LPDDR MCP combination memory with separate interfaces in a 14mm x 14mm, 152 BGA (ball grid array) package with a 0.65mm pitch. It features 1.8 volt flash and 1.8V LPDDR with an industrial temperature range of -40°C to +85°C and low voltage operation. The company plans to offer 4G-2G and 2G LPDDR versions later this year.
Thursday, July 14, 2011
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