ALMERE, THE NETHERLANDS: ASM International N.V. announced that it has shipped over 500 atomic layer deposition (ALD) reactors for use in semiconductor manufacturing to date.
The company now has ALD reactors in high volume manufacturing at a majority of advanced logic and memory fabs worldwide. This includes Plasma Enhanced ALD which provides advantages for certain applications, such as very low temperature processing.
ASM delivers the industry's broadest portfolio of ALD configurations and applications and is the only supplier in the market shipping both single wafer and batch ALD tools. ASM's plasma and thermal ALD systems are used in high volume manufacturing for a wide range of applications, including high-k and metals for advanced transistor gates, capacitor dielectrics and electrodes, and spacers for double patterning, among others.
Recognizing the value and importance of ALD to the future of semiconductor manufacturing, ASM has established ALD centers of excellence in Europe, US and Asia for material and precursor research, product development and process integration.
These innovative in-house R&D program investments have uniquely positioned ASM to bring ALD (thermal and plasma) to high volume manufacturing and enable its customers to achieve the performance required for the most advanced semiconductor devices.
Wednesday, July 13, 2011
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