Tuesday, July 12, 2011

Applied Materials showcases eight new products

Semicon West 2011, SANTA CLARA, USA: Applied Materials Inc. will showcase its technology innovations for producing future generations of microchips this week at Semicon West 2011 in San Francisco. Applied has introduced eight products over the last few weeks - all focused on enabling customers to solve the key challenges of manufacturing in a new era of chip design complexity.

"We are excited to be announcing new semiconductor technologies for manufacturing some of the most critical and challenging structures in our customers' new chip designs," said Mike Splinter, chairman and CEO. "These products from our Silicon Systems Group will enable chipmakers to address the inflections in new materials and architectures that will usher in a new era of high performance and functionality to satisfy the relentless demand for smarter, more connected mobile devices."

Applied's eight new products are designed to unlock the full potential of these high-performance devices, from the interconnect wiring to the most advanced transistor gate structures. These systems include: the Reflexion GT CMP for tungsten, the Vantage Vulcan RTP, the Centura DPN HD, the Endura Versa XLRTM W PVD, the Endura HAR Cobalt PVD, the Centura Integrated Gate Stack, the Producer Black Diamond 3 and the Producer Nanocure 3.

"The drive for greater speed and power efficiency is pushing the boundaries of scaling to find new solutions for our customers that enable manufacturing down to the atomic level with incredible precision and control," said Dr. Randhir Thakur, executive VP and GM of the Silicon Systems Group at Applied Materials.

"Process complexity has increased considerably and our multi-technology portfolio of products provides customers with integration solutions that can lower their process development times. Deep and early engagements with customers and R&D centers worldwide have enabled us deliver differentiated products for manufacturing advanced transistors, interconnects, 3D architectures and packaging. This is exactly where Applied's continued innovation and experience enable us to lead and excel."

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