Mobile World Congress 2011, BARCELONA, SPAIN: SanDisk Corp. announced its next generation of iNAND and iNAND Ultra embedded flash drives (EFDs) featuring smaller and thinner form factors.
Available in packages as small as 11.5mm x 13mm x 1mm, SanDisk’s new iNAND and iNAND Ultra e.MMC products support the increasing demand for slimmer and more compact smartphone and tablet designs.
SanDisk reduced its iNAND package sizes by using advanced 24nm generation NAND memory chips, which are more compact than previous versions, and reduced its iNAND package heights by using advanced packaging technologies. iNAND EFDs are based on SanDisk’s three-bit-per-cell (X3) NAND flash technology and iNAND Ultra EFDs are based on SanDisk’s two-bit-per-cell (MLC) NAND flash technology.
“For smartphones and tablets, every millimeter of thickness counts,” said Amir Lehr, vice president, embedded business, SanDisk. “Designers are constantly looking for new ways to make mobile devices as small and thin as possible. To meet that need, SanDisk’s advanced NAND process and packaging technologies allow us to pack more storage into smaller and slimmer footprints. This in turn enables OEMs to design more compact devices while freeing up precious board space for other needs, such as larger batteries.”