Transcend rolls out high density DRAM modules with 2Gbit DDR3 chips

NEW DELHI, INDIA: Transcend Information Inc. has launched three new 4GB DDR3 DRAM modules using high-density 2-gigabit (2Gbit) DDR3 chips: a DDR3 1333MHz Long-DIMM, a DDR3 1333MHz SO-DIMM, and a DDR3 1066MHz SO-DIMM.

Gordon Wu, Regional Head – South Asia, Transcend, said: “Our 4GB 240-pin DDR3-1333 Long-DIMM for desktops runs at 1333MHz with latencies of 9-9-9, while the 4GB DDR3-1333 SO-DIMM notebook memory module operates at 1333MHz with latencies of 9-9-9, and the 4GB DDR3-1066 SO-DIMM runs at 1066MHz with CL7 timings. Each module is optimized for stable 1.5V operation and is made with high density energy-efficient 2Gbit chips, enabling conscientious users to take advantage of the best power-performance ratio available for their desktop or laptop computer.”

Thanks to the adoption of cutting-edge high capacity 2Gbit DDR3 chips using the latest 40nm-class DRAM manufacturing process, Transcend’s new DDR3 modules can effectively increase a computer`s total memory capacity while reducing power consumption. These high-density chips not only bring the benefits of increased capacity and power efficiency, but also help prolong system lifetime--a crucial factor for server hardware.

All of Transcend’s DDR3 memory modules fully comply with JEDEC (Joint Electron Device Engineering Council) standards and are built with 256Mx8 high-quality DDR3 FBGA chips for their improved electrical and heat dissipation characteristics. Backed by Transcend’s lifetime warranty, each new DDR3 module offers unparalleled reliability for today’s desktops, laptops and workstations.