Microsemi intros world's smallest WLAN power amplifier for handsets and wireless modules

IRVINE, USA: Microsemi Corp., a leading manufacturer of high performance analog/mixed signal integrated circuits, high reliability semiconductors and RF subsystems, has announced the LX5514M power amplifier (PA) in a compact package that matches the industry's smallest 1.5x1.5mm, 0.4mm-high footprint.

Microsemi's LX5514M power amplifier supports IEEE 802.11b/g/n WLAN applications in the 2.4-2.5GHz frequency range. It joins the company's recently introduced LX5553 and LX5543 front-end modules (FEM) to continue its expansion into the fast-growing market for WLAN products used in space-constrained smartphones and other data-enabled cellular handset designs.

The device is based on the company's proven LX5514 PA, which has been streamlined to fit into a compact, ultra-low-profile package. Like the LX5514, the LX5514M includes fully matched input, simplified output matching, an integrated power detect function that not only saves board space but also reduces total BOM cost.

"Board area in today's smartphones is at a premium, and designers must squeeze more functionality into ever-smaller real estate," said Paul Pickle, Vice President and General Manager of Microsemi's Analog Mixed Signal Group.

"The LX5514M enables designers to add WLAN capability in nearly half the space of the prior generation of 2mmx2mm PAs, and with a much lower profile that enables today's slim, sleek handset designs. Customers get the industry-leading performance and efficiency of our PAs for routers and other networking equipment, in a package optimized for the stringent space requirements of smartphone designs."