TSV chips: Ready for prime time?

Dr. Robert Castellano, The Information Network

NEW TRIPOLI, USA: There was an article in EETimes on June 10 entitled “TSV chips: Not ready for prime time”. The article started out by stating: “At this week's International Interconnect Technology Conference (IITC), some experts came to the same conclusion about 3-D chips based on through-silicon-vias (TSVs): It's not ready for prime time.”

Findings in our report 3-D TSV: Insight On Critical Issues And Market Analysis have shown that in 2009, 500,000 silicon wafers were used in manufacturing TSV devices, representing 0.8 percent of the total 300mm equivalent wafers consumed in 2009 for semiconductor manufacturing. Yes it’s a small percentage, but it will reach 6 percent in 2013.Source: The Information Network.

The EETimes article also stated: "Only CMOS image sensors are using TSV in production" today," according to a report from VLSI Research. Memories with TSVs have been "altar for three years. (The) bride has not arrived." We disagree, and more than 50 percent of devices made were non CIS (CMOS image sensors).

In 2013, CIS devices will represent only 15 percent of TSVs. The big winner – Memory. It will grow to more than 30 percent of TSVs in 2013. More importantly, the TSV market will grow nearly 10X in the next three years in terms of wafers consumed.

Also of importance are the processing tools and materials purchased. While the equipment market was small, slightly more than $200 million in 2009, it will grow by a factor of 7X.