Thursday, June 3, 2010

Aptina delivers SoC imaging solution for 720P/30fps HD video

SAN JOSE, USA: Aptina, the leading innovator of CMOS imaging technology, has launched the MT9M114 System-on-Chip (SoC) 720P HD video imaging solution running at 30 frames per second (fps).

The new Aptina SoC has a 1/6”-optical format that enables low profile camera modules to easily meet thin sub-4mm height specifications, and makes the SOC an ideal solution for Netbooks, notebooks, monitors, televisions, and other applications using embedded web cameras.

The SoC’s 1.9-micron pixel rivals the performance of a 3.6-micron pixel and provides exceptional HD video running at 60fps when summing in VGA mode, and also compliments the feature set in the MT9M114 which was integrated to enhance the users’ video experience.

Designed specifically for video applications, this SoC addresses issues related to challenging web-camera exposure environments with features like weighted average exposure, adaptive backlighting, and 3CCM Auto White Balance (AWB) to adapt to all lighting conditions. Additionally, the SOC also provides a unique perspective correction feature to reduce the need for physical camera position adjustment.

“The MT9M114 is engineered for high quality HD video communication, addressing both embedded and tethered applications. The combination of low profile, advanced features and performance is precisely what our portable device customers are looking for,” says Farshid Sabet, Aptina’s General Manager of Mobile, PC and Gaming. “By providing this solution in an SOC rather than a standalone sensor, system engineering development is greatly reduced, and it helps speed our customers’ time to market,” adds Sabet.

Advanced functionality of the SOC includes an on-chip Image Flow Processor (IFP), multi-camera sync (up to seven cameras) and other camera-control features which can be paired with a broad range of USB backend ICs, even the lowest cost ones, without sacrificing the performance of the camera system.

The MT9M114 is available in CSP packaging and is presently sampling with availability in mass production in calendar Q3 2010.

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