SAN JOSE, USA: The market for semiconductor packaging materials, including thermal interface materials, is expected to reach $15.8 billion in 2009 and grow to $20.1 billion by 2013, according to a new study by SEMI and TechSearch International.
Laminate substrates remain the largest segment of the market, worth an estimated $6.8 billion globally in 2009, and on a unit basis are projected to grow at a compound annual growth rate of almost eight percent over the next five years.
The report, titled “Global Semiconductor Packaging Materials Outlook- 2009/2010 Edition”, covers laminate substrates, flex circuit/tape substrates, leadframes, bonding wire, mold compounds, underfill materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics and thermal interface materials.
The packaging materials market is in the midst of significant changes as new materials have been introduced and as the industry finds it difficult to identify new material solutions for 32 nm and below silicon technology generations.Source: SEMI, USA
The findings in the report are based on more than 140 in-depth interviews conducted with packaging subcontractors, semiconductor manufacturers and materials suppliers. It includes previously unpublished data on revenue, unit shipments and market shares for each packaging material segment; a five-year forecast of revenue and units (2009-2013), average selling price data and trends; and an analysis of regional market trends.
The report also identifies important technology and business trends affecting the packaging materials market, as well as opportunities for suppliers. Some of the key opportunities include:
* New laminate dielectric materials for 32 nm and 22 nm silicon technology.
* Thin core/coreless substrates with sufficient rigidity for processing.
* Cost-effective alternatives for gold wire.
* Resin materials compatible with low- and ultra low-k dielectrics and lead-free (Pb-free) processing at a competitive price.
* Mold compound or encapsulant materials for high wire density packaging.
* Underfill materials with CTE of 20 ppm.
* Over-molded underfills (OMUF).
* High thermal die attach film technology for multichip applications.
Source: SEMI, USA