Tamar provides non-destructive TSV depth measurement down to 1um for 3D packaging

NEWBURY PARK, USA: Tamar Technology's new Wafer Thickness Sensor (WTS) provides a non-destructive solution for measuring deep etch and Through Silicon Via (TSV) depth with unlimited aspect ratios.

The TSV depth measurement performance of Tamar's WTS is being qualified with major IDM’s, foundries and equipment suppliers. Its WTS measures TSV diameters down to 1 micron with unlimited depths, meaning aspect ratio concerns are eliminated.

"The measurement capability of the WTS allows semiconductor manufacturers to qualify their process across the wafer in a timely and cost effective manner that improves the overall utilization of the etch line," says David Grant, president of Tamar Technology. "Etch depth uniformity can now be verified in minutes in a non-destructive manner, allowing instant feedback for etch recipe generation."

The high speed data rates of Tamar's WTS allow it to be integrated into the Wafer etching tools, improving manufacturing yields and tool utilization by measuring the depth of an etch process immediately after etching. "This in-situ measurement capability gives real time process control where none existed before," says Grant.

In addition to TSV and deep etch measurements, Tamar's WTS measures wafer thickness for single or stacked wafers in applications such MEMS, SOI and wafer thinning operations where TSVs are exposed.

The WTS is offered through Tamar’s WaferScan Series or as an OEM module for integration into etching, grinding equipment and related process equipment.