CHARLOTTESVILLE, USA: ADI Engineering, the 'Open IP ODM' and a leading supplier of hardware platforms for embedded Intel architecture (IA, or x86) technology, has announced two new low-cost single board computers (SBCs) based on the Intel EP80579 integrated processor with Intel QuickAssist technology.
The models in ADI’s Ocracoke Island SBC product line bring lower price points, extended temperature operation, advanced robustness features, and ADI’s unique “Open IP” model of customer-directed manufacturing and licensing.
The EP80579 integrated processor is a highly integrated IA system on chip (SoC) that includes Intel QuickAssist technology to offload networking and security functions and simplify use of hardware accelerators.
ADI’s Ocracoke Island SBC line now consists of four models of Mini-ITX 170x170mm embedded boards that serve as ideal hardware platforms upon which OEMs can build their EP80579-based products. The new low-cost Ocracoke Island SBC models offer robustness features including -40C to +85C extended operating temperature range, ECC memory, and IEEE 1588 time synchronization on their Gigabit Ethernet and CAN interfaces.
The new SBCs serve demanding applications such as industrial controllers, wind turbine controllers, smart grid controllers and routers, ruggedized vehicle computers, train controllers, ruggedized storage, and externally housed networking, wireless, and communications devices.
1ku direct OEM unit prices are $349 for the new 600 MHz fanless Ocracoke Island SBC Model A600V and $459 for the fanless 1.066 GHz -40C to +85C Ocracoke Island SBC Model A1066XV.
“ADI’s new Ocracoke Island SBC models provide the performance, integration, extended environmentals and reliability demanded by OEMs in their mission critical products,” said Steve Yates, President, Founder and CTO of ADI Engineering. “These new SBCs expand the networking, IP media server and wireless markets already served by ADI’s Ocracoke Island SBC line to include smart grid, renewable energy, industrial, and other critical and often thermally unconstrained applications.”
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