NEW DELHI, INDIA & SINGAPORE: Strontium Technology of Singapore introduced its leading edge DDR-3 modules for notebooks and desktops for the Indian market. The retail packaged high speed DDR-3 modules are available in 1333MHz and 1066MHz speeds as 240 pin UDIMMs and 204 pin SODIMMs in 1GB and 2GB densities.
The modules would meet demands of enthusiasts and gamers looking for ever higher performance at more efficient power consumption parameters. Vivian Singh, CEO, Strontium Technology Pte Ltd, Singapore said, ‘Currently DDR-3 is servicing the high end leading edge segment of the market but it is steadily becoming main stream and we should see wider adoption over the next couple of quarters.’
DDR3 memory provides a reduction in power consumption up to 30 percent compared to DDR2 modules due to DDR-3's 1.5v supply voltage, compared to DDR-2's 1.8v. This means longer battery life for notebook user. The 1.5 V supply voltage works well with the Sub 70 Nm technology used in the DDR3 chips. The main benefit of DDR3 comes from the higher bandwidth made possible by DDR3's 8 bit deep pre-fetch buffer, in contrast to DDR2's 4 bit prefetch buffer or DDR's 2 bit buffer.
“This new line of Strontium DDR3 memory has undergone extensive compatibility testing to ensure that customers can enjoy a hassle-free experience,” said Singh.
Ajay Kogta, Country Manager, India Sub-continent, said: “Strontium memory modules are build to the highest specifications with the premium resources and chipsets from Major Brand like Hynix and Micron. The memory modules therefore manufactured, undergo challenging laboratory tests to ensure trustworthy value, performance and quality.”
Strontium DDR3-modules are currently available in 1 GB and 2GB capacities with a life time warranty. According to Kogta, “Strontium DDR-3 modules would be available through our regular channel partners. This will help all our partners to get familiarized with the new product and they would be well positioned to take advantage of growing market when DDR-3 becomes mainstream product in the near future.”
Tuesday, May 19, 2009
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