Tuesday, June 4, 2013

Teledyne DALSA announces MEMS integrated design for inertial sensors (MIDIS) platform

CANADA: Teledyne DALSA Semiconductor, a Teledyne Technologies company and a world-leading pure-play MEMS foundry, announced the availability of its new MIDIS 200 mm MEMS fabrication platform for motion sensing devices.

The platform is designed to provide high volume, low cost manufacture of accelerometers and gyroscopes or the integration of both into an Inertial Measurement Unit (IMU), addressing the rapidly expanding demand for inertial sensors for consumer (mobile), automotive, and sports/health applications.

“Our MIDIS platform is a break-through technology that greatly reduces time to market by using a standardized process, rather than developing each new device from the ground-up, while making no compromises in  performance,” said Donald Robert, VP of Marketing at Teledyne DALSA Semiconductor.

“Our high performance Through Silicon Via (TSV) and wafer bonding approach provides high vacuum and hermeticity, without the need for expensive getters, in a very compact wafer level package.”

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