austriamicrosystems intros 'more than silicon' initiative

UNTERPREMSTAETTEN, AUSTRIA: austriamicrosystems Full Service Foundry business unit has introduced its “More Than Silicon” initiative, a comprehensive service and technology package that goes beyond industry standard foundry services.

Foundry customers instantly benefit from access to leading edge technology add-ons, advanced packaging services and dedicated support engineers to enable first-time-right designs.

The “More Than Silicon” offering provides austriamicrosystems’ foundry customers access to leading edge 3D-IC integration using austriamicrosystems’ patented Through Silicon Via technology (TSV).

This advanced TSV technology enables the smallest form factors and addresses a variety of markets demanding 3D integration of CMOS ICs, photo sensors, power devices or MEMS components required in automotive, industrial and consumer applications.

Foundry customers using the austriamicrosystems TSV concept immediately benefit from a significantly reduced form factor, systems cost reduction and utmost flexibility in IC and sensor arrangement. The leading edge technology add-on package also features a broad memory portfolio, including SRAM, ROM, BIST structures, One-Time-Programmable (OTP) and fully automotive qualified high reliability non-volatile memories (EEPROM and FLASH).

The “More Than Silicon” package comprises dedicated customer support for specialty foundry projects throughout the entire product value chain, including project definition, design, tape out, prototyping and high volume production.

Highly skilled and experienced engineers provide consulting services such as design and layout reviews, ESD and EMC consultancy, Place & Route and test program development for wafer sort and final test. Wafer Level Chip Scale Packaging (WL-CSP) is now available as well as assembly services for commonly used ceramic and plastic packages.

“Requirements for leading edge analog products have gone beyond the first-time right silicon design. The integration of the IC with advanced analog packaging and post-processing technologies is a must to bring a new breed of analog products to the market. austriamicrosystems’ “More Than Silicon” initiative uniquely supports these requirements and provides fabless design houses with access to special libraries and IP blocks, leading edge technology add-ons and dedicated support engineers,” said Thomas Riener, senior VP and GM of austriamicrosystems' Full Service Foundry business unit.

“Foundry customers instantly benefit from our new “More Than Silicon” initiative, which is a clear commitment to our customers to help them with manufacturing their complete analog IC product.”