TrendChip intros world's first IAD solution with 2-layer circuit board

HSINCHU, TAIWAN: Leading manufacturer of xDSL CPE chips, TrendChip Technologies Corp., announced a series of IAD (Integrated Access Device) solutions, seizing business opportunities brought about by the Next Generation Network's (NGN) conversion of traditional analogue telephone into a fully digitalized, and IP-based model.

The first solution is TC3182P2V, a highly integrated IAD solution for voice, video, data and wireless services. It possesses high-performance ADSL2+ and 802.11n, and its carrier-level voice quality. The second solution is TC3182LEV.

This solution is especially designed to meet the requirements of emerging markets' DSL-ATA (Analog Terminal Adapter). These solutions also mean that current limitations posed by the relatively expensive 4-layer circuit boards required by other IAD products will no longer apply, and 2-layer designs can be used directly, bringing IAD products into the new age of "being expensive in look, but not in price."

TrendChip has used the powerful processing core, MIPS 34Kc, 2 Virtual Processing Elements (VPE), and the multi-threading system structure, in this series of IAD solutions, achieving not only the excellent network performance of wired speed, but also enabling IAD to maintain high definition quality in its voice signals even under high network traffic, thus ensuring the Quality of Service (QoS).

At the same time, these solutions are compatible with RADVision(R) SIP (Session Initiation Protocol), which is the most common in the industry and has full interoperability. The solutions also offer voice compression coding formats, such as G.711, G.723, G.729, and G.722, in order to satisfy the requirements of different telecommunications specifications.

These IAD solutions include 2 types, TC3182P2V and TC3182LEV.