Tuesday, June 8, 2010

Tegal receives repeat order for Tegal 4200 SE cluster tool silicon DRIE process module

PETALUMA, USA: Tegal Corp., an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, has received an order for an additional Tegal 4200 SE DRIE cluster tool process module from a leading EU-based supplier of MEMS and Power IC devices.

The Tegal 4200 SE DRIE process module will be shipped and installed at the customer’s site in the next fiscal quarter, and will add to the customer’s overall production capacity for high volume manufacturing of MEMS and Power IC devices.

The Tegal 4200 SE cluster tool silicon DRIE process module order from this repeat Tegal DRIE customer follows the successful installation, process qualification, and sustained use of silicon Deep Reactive Ion Etch processes on the customer’s first Tegal 4200 SE cluster tool PM.

“Our customer is known for their technological leadership in the MEMS and Power IC markets, and we see this repeat order as confirmation of the Tegal silicon DRIE tool’s superior performance in high volume manufacturing,” said Yannick Pilloux, DRIE Product Manager at Tegal.

“We believe that our DRIE process modules are the most reliable and most advanced on the market and, as this repeat order shows, we have been able to meet our customer’s demanding technical requirements for silicon DRIE cluster tools, while providing excellent value along the way.”

The Tegal 4200 SE is an advanced, world-class cluster tool system dedicated to Deep Reactive Ion Etch applications. Featuring an inductively coupled plasma etch reactor and magnetic plasma confinement, the tool can run Tegal’s patented SHARP – Super High Aspect Ratio Process, achieving etched feature aspect ratios of >100:1 in production environments.

The Tegal 4200 cluster tool can be configured with up to four process modules, and two cassette modules, for High Volume Manufacturing applications for the most frequently used materials in MEMS and semiconductor device fabrication: Silicon (Si), Silicon On Insulator (SOI), and Silicon Dioxide (SiO2).

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