EINDHOVEN, THE NETHERLANDS: NXP Semiconductors has announced two new small-signal discrete leadless packages measuring 2x2mm with industry‘s lowest height of 0.65mm.
Available in a 3-lead (SOT1061) and a 6-lead (SOT1118) version, the plastic SMD (Surface Mount Device) packages offer an increased lifetime with an exposed heat sink for excellent thermal and electrical conductivity.
The new products – including 26 types of FET-KYs, dual P-channel MOSFET, low VCEsat transistors and Schottky rectifiers – achieve power dissipation Ptot up to 2.1 Watt. This performance is comparable to products in industry standard package SOT89 (SC-62) while only taking less than half it‘s space on a PCB.
“As board space and power consumption are critical factors in the design of today‘s thin, compact and battery-driven devices, NXP provides a broad portfolio of small packages supporting the industry drive towards smaller form-factor end-user devices,” says Ralf Euler, product marketing manager for small-signal discretes, NXP Semiconductors.
“The new portfolio is ideal for applications such as high performance charging circuits, load switches and Switch Mode Power Supply (SMPS) in mobile equipment, smart phones and laptops.”
The SOT1061 and SOT1118 are free of halogens and antimony oxides and comply with non-flammability classification UL 94V-0 and RoHS standards.
Samples of all new discrete devices in SOT1061 and SOT1118 are available immediately for design-in. The low VCEsat (BISS) transistors and low VF single Schottky rectifiers in SOT1061 are ready for ordering. The NXP P-Channel MOSFET and FET-KY portfolio in SOT1118 as well as the dual Schottky rectifiers in SOT1061 will available in volume end of June.
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