SANTA CLARA, USA: Tensilica, Inc. today announced that DOCOMO Capital Inc. has made a strategic investment in Tensilica. DOCOMO Capital is the corporate venture arm of NTT DOCOMO, Japan’s leading wireless carrier.
Tensilica is a major semiconductor IP (intellectual property) supplier specializing in dataplane processor cores, which are a combination of CPU and DSP that can be rapidly customized to provide 10-100x the performance of standard CPUs and DSPs. Tensilica’s DPUs (dataplane processing units) are widely used in system-on-chip (SoC) designs for mobile consumer devices.
“We recognize the growing importance of Tensilica’s customizable DPUs for semiconductors that enable lower power and innovative mobile devices, and that’s why we made this investment,” stated Tomoya Hemmi, president and CEO, DOCOMO Capital. “Tensilica’s high-performance DPUs for audio, video and baseband functions will be key enablers for new capabilities and increased battery life in future mobile telephones.”
“NTT DOCOMO is well respected for its deep involvement in the holistic design of its mobile networks, down to the algorithms, semiconductors and systems technology employed in the handsets. We are excited about our new, closer relationship with this tech savvy carrier and work with them to drive new technology and the early deployment of new standards,” stated Jack Guedj, Tensilica’s president and CEO.
“We are also pleased that our major capital investors - Foundation Capital, Meritech Capital Partners, Oak Investment Partners and Worldview Technology Partners - participated along with DOCOMO Capital in this financing round.”
Tensilica, Inc. is a privately held company. The Gartner Group, in its March 2009 report on the semiconductor IP market, recognized Tensilica as the fastest-growing semiconductor IP supplier.
Monday, June 22, 2009
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