Friday, September 9, 2011

Canon’s FPA-5510iV first back-end semiconductor lithography tool for 3D packaging

SAN JOSE, USA: Canon USA Inc., a leader in digital imaging, has announced its entry into the semiconductor back-end manufacturing tool market with the launch of the FPA-5510iV semiconductor lithography tool for next-generation semiconductor packaging.

As smart phones, tablet PCs and other electronic devices become progressively smaller and more intelligent, the demand for integration and shrinkage on semiconductor devices continues to increase. One way to realize such integration is to employ a three-dimensional layout of chips, layering multiple semiconductor chips vertically and interconnecting the chips to configure a single device. To facilitate this interconnection, the industry has developed Through Silicon Via (TSV) and Bump processes, enabling multifold increases of memory capacity, high-speed data transfer, and reduced electricity consumption in a smaller layout area.

The launch of the new Canon FPA-5510iV semiconductor lithography tool accommodates the industry’s TSV and Bump process needs. The tool, which utilizes technology cultivated through the company’s best-selling FPA-5500iZ front-end tool series, marks Canon’s first-ever back-end lithography stepper. Relative to back-end steppers, the tool delivers high resolution, high throughput, and high overlay accuracy to meet the rapidly progressing device demands on performance and integration.

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