MINNEAPOLIS, USA: FSI International Inc. received multiple ORION single wafer cleaning system orders. The orders were received during the third quarter of fiscal 2011 and are expected to ship in the second half of calendar 2011.
One customer is a memory producer that plans to use the system for front-end-of-line (FEOL) wet photoresist strip and middle-of-line (MOL) metal etch applications. Increasingly, memory manufacturers are transitioning from batch immersion to single wafer technology to improve defectivity and cycle time performance. The ORION system with its inherent short process times and integrated atomized spray bar provides these benefits.
The second customer is a foundry producer and will use the system for back-end-of-line (BEOL) cleaning processes. Foundry and logic manufacturers are finding low-k materials and metal film stacks used for advanced devices are much more sensitive to wet cleaning than previous generations of BEOL processes. The closed chamber technology of the ORION® system has demonstrated highly efficient removal of etch and ash by-products without causing galvanic corrosion or changes in metal and dielectric film properties.
Wednesday, June 1, 2011
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