Cadence extends IP offering, collaborates with TSMC via Open Innovation Platform

DAC 2011, SAN DIEGO, USA: Cadence Design Systems Inc. announced a close collaboration with TSMC that will extend its interface IP offering. For years, the Cadence design services team has worked with TSMC to deploy designs integrating complex, high-speed interfaces at advanced nodes. Building on that relationship, TSMC is now jointly working with Cadence engineers to develop IP by contributing “seed IP” to the effort. The resulting IP will be marketed and sold by Cadence.

“We expect our close working relationship with Cadence to have far-reaching benefits for our mutual customers,” said Suk Lee, director of Design Infrastructure Marketing at TSMC. “Complex IP development and integration at advanced nodes requires IP suppliers and foundries to work more closely together than ever before. Collaborations such as this one further the goal of our Open Innovation Platform to speed innovation in the semiconductor industry.”

The initial outcome of the engineering collaboration will be certified solutions to support the pervasive USB 2.0 and 3.0 standards. The solutions will be supported and sold by Cadence. The team has already delivered a certified USB 2.0/3.0 PHY/PCS/controller for on-going, advanced node development.

“Our extended collaboration strengthens an already close working relationship and ensures the availability of IP that has been validated where it matters most – at the foundry,” said Vishal Kapoor, VP of marketing for SoC Realization at Cadence. “Our relationship exemplifies how IP suppliers and foundries must work together so that our customers can overcome rising design complexity challenges. It is a critical step in delivering on the strategy we outlined in our EDA360 vision last year.”

As the industry migrates to advanced nodes, design teams will require IP that has been designed to account for the growing impact of process variations. They will need IP that is closely tied to the target process technology, and is fully supported by a sophisticated integration environment spanning silicon, package and board.

Understanding these market requirements, Cadence supports its IP with a comprehensive design environment that includes design-in kits, verification IP, advanced flows and methodologies to ensure successful integration.