GENEVA, SWITZERLAND: Pushing the boundaries of innovation for mobile handset technology, ST-Ericsson today introduced two new highly-integrated connectivity solutions –- a single-chip multimode Bluetooth, GPS and FM combination, and an ultra-low power WLAN device.
ST-Ericsson’s CG2900 is the world’s smallest Bluetooth, GPS and FM combination chip to offer best-in-class audio quality, high-precision GPS services and improved battery life on mobile phones when using Bluetooth, GPS and FM applications.
Suited for mass-adoption in smartphones, feature phones and high-volume low-end handsets, the CG2900 is a tightly integrated single-chip device. It delivers an unparalleled experience for consumers using multiple connectivity features simultaneously.
ST-Ericsson has also launched ultra-low power IEEE 802.11n WLAN device, the CW1100, to deliver high-speed and reliable internet experience to consumers. The CW1100’s power efficiency significantly reduces power consumption, which has been the biggest challenge with WLAN on mobile phones.
Consumers will no longer need to switch off WLAN when it is not in use. Available as a standalone product, the CW1100 also fits perfectly with the CG2900, using streamlined interfacing techniques to offer handset manufacturers a comprehensive, ready-to-market connectivity solution.
“As more consumers start accessing Internet-based applications and GPS-enabled services, exchanging information over Bluetooth and WLAN, and enjoying FM radio, manufacturers constantly need design innovation to create more exciting mobile devices,” said Thierry Tingaud, Vice President 2G,Edge,TD-SDMA and Connectivity, ST-Ericsson.
“With the world’s first 45-nm single-chip for Bluetooth, FM, GPS combination, ST-Ericsson is driving innovation in connectivity and broadcast to a new high. Building on our expertise in integration and a strong portfolio of wireless solutions, we are helping customers to go-to-market faster with more competitive products.”
ST-Ericsson’s CG2900 and CW1100 boast the industry’s smallest footprint in their category -– enabling sleek and thin designs and lower bill-of-material costs for manufacturers.
Sampling in 2009, both devices will be available in mobile handsets in the second half of 2010.