BANGALORE, INDIA: Fujitsu Microelectronics Asia Pte Ltd (FMAL) today announced the first product in its entry into the mobile phone RF transceiver market, in launching a RF transceiver IC for mobile phones supporting 2G GSM/GPS/EDGE and 3G UMTS/HSPA protocols, that includes a 3G DigRF interface on a single chip.
The compact new transceiver IC also eliminates the need for external SAW filters, and low-noise amplifiers (LNA) and enables mobile phone manufacturers to reduce component count, board space and bill of materials.
While a simplified programming model helps to significantly reduce development time and simplify integration of the RF into a radio platform. Samples of the MB86L01A transceiver IC are available from today.
In today’s global mobile phone markets there are increasing needs for multimode support for the various 2G and 3G communications protocols in use, as well as multiband support for the various frequency bands used in different regions, and allotted to different carriers.
Mobile phone manufacturers are faced with trying to supply not only the multitude of combinations of these modes and frequencies, but also have to deal with the demands of ever-shortening product lifecycles and smaller form-factors. This new MB86L01A RF transceiver IC is designed to help mobile phone manufacturers meet these demands.
The new RF transceiver IC supports all frequency bands for 2G protocols of GSM/GPRS/EDGE, as well as supporting a maximum of four bands simultaneously within the 10 frequency bands of the 3G protocols -- UMTS/HSPA.
The MB86L01A transceiver also embeds LNAs on-chip, so external LNAs are not required as they were previously. Also, an architecture is employed that eliminates the need for external SAW filters, thus reducing total component count. Enclosed in a small form-factor 142-pin LGA package of 7.1x5.9mm, the reduced space of the RF system helps realize smaller form-factor mobile phones.