Saturday, June 4, 2011

Shrink Nanotechnologies closes transaction to sell BlackBox Semiconductor and its IP for leading semiconductor technologies

IRVINE, USA: Shrink Nanotechnologies Inc. and BlackBox Semiconductor Inc. announced the execution of the share exchange whereby 100 percent of the equity interests of BlackBox Semiconductor Inc. (the Nevada company) were sold to BlackBox Semiconductor Inc. (the publicly traded Delaware company). Additionally, a cash payment is due to be made to Shrink and BlackBox is to receive approximately 14,000,000 shares of Shrink common stock.

Shrink CEO, Mark L. Baum, commented: "We are happy to have executed the final share exchange agreement to sell BlackBox Semiconductor which will trade as a separate public company. We believe this transaction will unlock significant value for Shrink's shareholders as the BlackBox management team, led by David Duncan, CEO of BlackBox, execute on a well thought out and promising business strategy to bring 'electronic glue' chemistries to many multi-billion dollar market opportunities."

BlackBox's semiconductor chemistries are being developed to manufacture rigid and flexible surfaces and enable large semiconductor devices. Semiconductor nanostructures exhibit unique optical and electronic properties that have the potential to create a new generation of semiconductor materials for a range of large market applications including:
(i) Photovoltaics,
(ii) Energy storage,
(iii) Optical sensing and;
(iv) Other printed electronics.

Semiconductor electronic glue chemistry incorporates engineered inorganic semiconductor and metal nanostructures with proprietary and patent pending electronic glues that are maintained and deposited in liquid form. BlackBox semiconductor liquids can be deposited using low-cost printing and other high throughput techniques to create high-performing, solid semiconductor films and structures.

BlackBox technology solves the problem of previously attempted solution-processed inorganic semiconductor methods that were limited by poor electronic performance. Its electronic glue chemistry allows efficient transfer of electric charges between the semiconductor nanomaterials and results in high transport and mobility of charge carriers through the manufactured semiconductor solid.

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