OCP-IP delivers memory model package

BEAVERTON, USA: Open Core Protocol International Partnership (OCP-IP) announced the availability of an Accurate Dynamic Random-Access Memory Model (ADM) package. The ADM is a configurable, transaction-level model for Dynamic Random-Access Memories (DRAMs). This model is more accurate than existing DRAM models currently used for system-simulation because it considers the major delay parameters of real DRAMs and imitates their timing behavior with access dependencies captured.

A demonstration program provided in the package can be used to test the delay and throughput of the DRAM for certain traffic flows, more accurately representing the performance of systems and enabling a realistic evaluation of Networks on Chip (NOCs) deployed in those systems.

The model package was developed in SystemC using OCP-IP’s TLM Kit, and can be combined with other OCP-compatible modules through an OCP TL1 interface. The OCP TLM kit is the first, and most advanced TLM-2.0 based, industry-ready kit. The TLM Kit significantly increases performance, ease-of-use and ensures alignment with the OSCI 2.0 standard. The kits are free, as part of OCP-IP membership entitlement and save users hundreds of thousands of dollars annually in development, documentation, and training costs otherwise required to develop such kits independently.

This new ADM package was developed by Royal Institute of Technology (KTH) in conjunction with members of OCP-IP’s Network on Chip Benchmarking working group including: Tampere University of Technology, Boston University, University of British Columbia, Carnegie Melon University, Princeton, Washington State University, and Transylvania University in cooperation with industry members of the OCP-IP.