TOKYO, JAPAN: Fujikura Ltd announced an exciting collaboration with FlipChip International, LLC of Phoenix, Arizona USA on next generation semiconductor packaging technology. FCI and Fujikura have agreed to partner on the further development and commercialization of next generation semiconductor packaging including flexible substrate based embedded die, Fan-Out packages, and high density, 3D interposer technologies.
Bob Forcier, CEO at FlipChip, said: "Fujikura is a recognized global leader in interconnect technologies ranging from optical connection to high speed copper interconnects. Fujikura Limited has a powerful technology roadmap which complements perfectly with FCI's product roadmap. We feel privileged to have them as a partner."
Takamasa Kato, executive VP and member of the Board of Fujikura, said: "FCI is a world leading WLCSP and bumping supplier and have a great deal of experience and aggressive programs of future business in the semiconductor packaging field. We consider that FCI is the most reliable partner for us to co-operate in this exciting field."
Tuesday, June 14, 2011
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