Wednesday, June 1, 2011

DSP Group releases groundbreaking XpandR III wireless multimedia chip

SAN JOSE, USA: DSP Group Inc. announced the release and availability of XpandR III, the next generation in the company's XpandR family of multimedia chipset solutions. The world's only system on a chip (SoC) integrating Wi-Fi and DECT, the cutting-edge XpandR III supports voice, video, audio and data on an advanced low-power system, making it the optimal enabler of cost-efficient telephony, VoIP, video communications, and multimedia applications.

The comprehensive, highly integrated solution is offered with a complete hardware and software development kit. XpandR III reduces system bill of materials (BOM), development efforts, and time to market for tablet/media phones, video phones, high-end IP phones, Wi-Fi handsets, home control and surveillance and other connected multimedia, voice and video terminals.

Operated by a powerful 1GHz ARM Cortex-A8 application processor and 300MHz ARM9 co-processor, the high-performance 1.3GHz processing power XpandR III enables value-added applications as well as voice and data connectivity to enhance the user experience. A complete hardware and software solution, all-in-one, XpandR III includes diverse semiconductors SoC, Wi-Fi and DECT module development boards, form-factor reference designs, embedded software packages and an Android-based software development kit (SDK) with reference applications.

"The market for affordable, easy-to-use devices that harness the power of multimedia in the home environment has great potential, and is just getting started," said Oz Zimerman, corporate VP of Marketing and Business Development at DSP Group. "By combining a powerful dual-core system on a chip with both Wi-Fi and DECT, XpandR III represents a new era in home connected multimedia terminals and telephony."

The XpandR III SoC features advanced multimedia hardware engines with a high-definition (HD) 1080p multi-format video decoder supporting Google WebM (VP8), and an HD multi-format video encoder enabling full-duplex HD videoconferencing and video recording. Built with a 2D/3D graphics engine supporting Open GL ES 1.1/2.0 and a dedicated security processor for secure boot/storage and DRM, XpandR III offers Wi-Fi, Wi-Fi Direct and DECT/CAT-iq embedded connectivity.

"The latest in our line of advanced chipset solutions, XpandR III brings together voice, video, audio and data to open the door to innovative applications such as visual telephony, multimedia streaming, media-content sharing, and home control and monitoring," Zimerman said. "Providing CE manufacturers with a highly integrated, single-vendor, cost-optimized solution, XpandR III not only promotes mass market adoption, but also ensures fast time to market."

Targeting both portable and stationary products, the complete XpandR III solution is now available for original design manufacturers (ODMs) and original equipment manufacturers (OEMs) interested in launching new project development.

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