Friday, June 3, 2011

Dorado Tweaker ECO platform in use at TSMC for integrated signoff flow

DAC 2011, HSINCHU, TAIWAN: Dorado Inc., a semiconductor design software provider, announced that TSMC is using Tweaker ECO (Engineering Change Order) platform for incremental optimization in TSMC’s Integrated Signoff Flow (ISF). This new addition in ISF brings TSMC’s customers an incremental design closure flow using Tweaker for post-place and route timing fix, leakage power recovery, as well as clock skew fine-tuning.

“Designers can benefit from a more powerful ECO closure flow while dealing with increasing design complexity going into advanced technologies,” said Suk Lee, director of Design Infrastructure Marketing at TSMC. “The inclusion of Tweaker in ISF is a milestone of TSMC’s partnership with Dorado helping customers leverage EDA innovations.”

Tweaker is fundamentally architected for ECO incremental jobs. It relies on the signoff quality input data to perform “local optimization” which focuses only on the critical parts of the design. The approach minimizes the turnaround time, correlation issues, and the impact to the performance, while maximizing the tool capacity.

“We are glad that TSMC and its customers can now use Tweaker through ISF,” said Jun-Jyeh Hsiao, co-founder and Executive VP of Dorado. “With the Tweaker ECO Platform added to TSMC’s ISF, we ensure that our mutual customers complete their incremental jobs with reliable, correlated results.”

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