Friday, December 4, 2009

TEL joins SEMATECH’s Front End Processes Program at UAlbany NanoCollege

ALBANY, USA & TOKYO, JAPAN: Tokyo Electron Ltd (TEL) and SEMATECH announced that TEL has joined SEMATECH’s Front End Processes (FEP) program at the College of Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex. The joint partnership will establish a collaborative approach to develop new materials and processing techniques for extending CMOS logic and memory technologies.

As a member of this program, TEL will closely collaborate with SEMATECH’s FEP research team at the UAlbany NanoCollege, with support from SEMATECH’s facilities in Austin, TX. Specifically, TEL experts will leverage SEMATECH activities in advanced materials, device structures, and physical and electrical characterization infrastructure to develop cutting-edge new processes and associated tools.

“As device scaling becomes more and more difficult and as end products in electronics become more diversified, the integration of the processes, materials, and devices that will define next generations of CMOS and non-CMOS technology will become increasingly important,” said Masayuki Tomoyasu, Senior Vice President of TEL Technology Center, America, LLC.

“SEMATECH’s FEP program blends innovation with practical solutions to meet technical and economic requirements and move the industry forward. SEMATECH provides the most suitable development foundation for TEL to apply our current wafer process knowledge to develop new techniques for extending advanced memory and logic technologies.”

“TEL has been a valued partner of SEMATECH for many years and across many projects, including an ongoing strong interaction on 3D interconnects. Given their leadership in providing state-of-the-art tool solutions that are manufacturing friendly, we are very pleased to expand our partnership with TEL on advanced materials and device technologies,” said Raj Jammy, SEMATECH’s vice president of materials and emerging technologies.

“Building on the success of past and present collaborations, we look forward to working closely with TEL to provide an excellent platform for development of leading edge memory and logic process solutions for future generation technologies.”

Richard Brilla, vice president for strategy, alliances and consortia at CNSE, said: “We are delighted to welcome this new partnership between SEMATECH and TEL, both of which are among the global technology leaders engaged in next-generation nanoelectronics research and development at the UAlbany NanoCollege. This new collaboration will enable advanced materials and process development to support the critical needs of industry, while further demonstrating the success of the SEMATECH-CNSE alliance in accelerating leading-edge technologies.”

The goal of SEMATECH’s FEP program is to provide novel leading-edge materials, processes, structural modules and electrical and physical characterization solutions to support the continued scaling of logic and memory applications.

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