MIPS, Tensilica to accelerate SoC design activity on Android platform

SUNNYVALE & SANTA CLARA, USA: MIPS Technologies Inc. and Tensilica Inc. are working together to accelerate SOC (system-on-chip) design activity on the popular Android platform.

Together, MIPS and Tensilica will help companies speed the design of new home entertainment and mobile consumer products based on Android. A joint demo of a MIPS32 processor core integrated with Tensilica's HiFi 2 Audio DSP will be on display in suites that both companies have at the Consumer Electronics Show in Las Vegas, January 7-10, 2010.

"As we continue to push Android into a broad range of consumer electronic products, we are building a complete partner infrastructure to offer a total MIPS-Based Android solution to designers of next-generation connected devices," stated Art Swift, vice president of marketing for MIPS Technologies.

"Tensilica's HiFi 2 Audio DSP is an ideal audio processor because it is proven in millions of consumer devices, has low power consumption, and comes with a comprehensive library of over 60 audio codecs for just about any standard from simple MP3 to Dolby and DTS, plus a full suite of partner solutions for audio post processing."

"We are impressed with the roadmap MIPS Technologies has put together for Android and its vision that will enable a new generation of connected multimedia devices," stated Mahesh Venkatraman, vice president of marketing, vertical segments, for Tensilica.

"By working with MIPS, we can provide chip designers with a proven high-quality audio solution that will span connected devices ranging from mobile wireless phones to low-cost digital picture frames, high-definition DTVs, set-top boxes, Blu-ray disc players and more."

MIPS Technologies will display the jointly developed technology at CES in its suite at the Las Vegas Hilton. Tensilica will display the jointly developed technology at CES in its suite in the South Hall of the Las Vegas Convention Center, suite South 4 35567MP.