Vitesse and Dune Networks deliver interoperable end-to-end solution

SUPERCOMM 2009, CAMARILLO, USA: Vitesse Semiconductor Corp. and Dune Networks, a leading supplier of networking and switching silicon devices for intelligent, scalable, and reliable switching, announced the successful co-simulation and interoperability of Vitesse’s next-generation XAUI and VAUI interfaces with Dune’s XAUI, SPAUI and RXAUI interfaces.

When using the complementary and now interoperable product offerings from Vitesse and Dune, telecom OEMs can confidently shorten their design schedules and increase the possibility for first-time success when building high-performance Ethernet switches and routers for the Enterprise, data center and Carrier Ethernet markets from merchant silicon.

Extensive device interconnect interface interoperability was validated as part of the joint solution. Validated interfaces included XAUI, VAUI/SPAUI, RXAUI, SGMII, QSGMII, and more specifically:

* Vitesse’s XAUI (VAUI) and Dune’s SPAUI interfaces offer extensions to the XAUI standard to provide out band flow control and channelized packet interface capabilities. Supporting channelized packet interfaces enables data separation by priority, port or VLAN in oversubscribed carrier applications, delivering superior Quality of Service (QoS) treatment of the data.

* The VAUI and SPAUI interfaces also support an overclocked 12 Gbps mode for higher bandwidth applications.

* Reduced XAUI (RXAUI) is a two-lane by 6.25G implementation of the XAUI standard. RXAUI was defined to minimize the number of SerDes lanes required to handle 10 Gigabit Ethernet (GbE). By making use of 6.25G SerDes speeds, RXAUI cuts in half the number of required lanes.

* Quad SGMII (QSGMII) is a single-lane by 6.25G implementation of a quad SGMII interface used for 4 ports of 1 GbE. By making use of 6.25G SerDes speeds, QSGMII cuts by a factor of four the number of required lanes.

“Verifying interface interoperability of Vitesse’s MACs and PHYs with Dune’s PETRA™ devices provides customers with a ‘first time – done right’ experience when bringing up the combined solution,” said Tony Conoscenti, vice president of product marketing for Vitesse. “These advanced interfaces bring value added QoS, faster speeds and higher interconnect density to our customers’ next-generation systems.”

Vitesse offers a line of energy efficient single-, quad- and octal-port Gigabit Ethernet (GbE) Copper PHYs (i.e. VSC8664) as well as 1 GbE and 10 GbE MAC devices that deliver increased line card port density at reduced per port costs.

The MACs provide a single-chip solution for the design of 1 GbE and 10 GbE line ports with support for 100M optical ports. In addition, the MACs, such as the Vitesse VSC7344, support internal packet buffering, QoS and channelized XAUI interfaces with flow control to sustain QoS and oversubscription at the line interface. To learn more about how these products enable Carrier Ethernet solutions visit: www.vitesse.com/ce.

The PETRA device from Dune integrates packet processing, traffic management and fabric access functionality. By integrating packet processing into the PETRA line of devices, Dune’s solution offers the ability to design high-density switching line cards for data center and Carrier access applications utilizing a variety of options for network connectivity, including XAUI, XAUI+ (SPAUI), RXAUI, SGMII, and SGMII+.

“We are excited to collaborate with Vitesse to bring our customers a complete end-to-end solution from PHYs to Switch Fabric,” said Ori Aruj, vice president of marketing for Dune Networks. “Market forces and time-to-market demands are driving our customers to look to their suppliers for more standardized interfaces and certification of interoperability that will bring about competitive decreases in development time and effort.”

Interoperability test results are available now to Dune and Vitesse customers by contacting their local sales representative. Interested parties can also learn more by visiting Dune Networks at booth #4355 during SUPERCOMM 2009 at McCormick Place in Chicago, October 21-23, 2009.