Wednesday, August 19, 2009

Shocking Technologies certifies Sanmina-SCI

SAN JOSE, USA: Shocking Technologies Inc., a leading developer of next generation embedded electrostatic discharge (ESD) protection solutions, certified Sanmina-SCI Corp., a leading global electronics manufacturing services (EMS) company, to manufacture PCBs with the Shocking Technologies embedded XStatic technology.

The certification allows Sanmina-SCI to manufacture PCBs that meet the industry-standard electrical, mechanical and reliability specifications in addition to providing superior ESD resistance and lower-system cost.

“We’ve had a very productive collaboration with Shocking Technologies and we are looking forward to being the first to commercialize this exciting technology,” said George Dudnikov, Senior Vice President and Chief Technology Officer for Sanmina-SCI’s PCB and Backplane Divisions.

“We’ve already demonstrated comprehensive ESD resistance in a sensitive memory application using XStaticTM material. Migrating to an embedded ESD protection approach from today’s discrete approach means global system protection and significant cost savings.”

“Our XStatic material is designed to be highly compatible with standard PCB manufacturing processes which will enable quick adoption,” explained Lex Kosowsky, CEO of Shocking Technologies.

“This compatibility was demonstrated in our collaboration with Sanmina-SCI and we are pleased to have an industry leader as our first certified PCB supplier. The help and support provided by the Sanmina-SCI team has been key in making Shocking Technologies’ solution a reality. Products containing XStatic technology will reach the market in the coming months. We look forward to proliferating the technology to other PCB manufacturers in the very near future.”

Shocking Technologies’ XStatic technology is based around a patented switchable polymer nano-composite that switches between insulating and conductive states. A thin continuous XStatic layer is contained in the PCB which provides comprehensive protection by shunting ESD-related destructive currents away from the device circuitry all within a nano-second of being pulsed.

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