Sensors Expo 2011, WATERLOO, CANADA: Teledyne DALSA will feature its latest advancements in MEMS fabrication along with its innovative HV ASIC design capabilities at Sensors Expo in Rosemont, IL, June 6-8, 2011 in booth # 309. Sensors Expo 2011 is the leading forum on sensing technologies and solutions in North America.
Teledyne DALSA’s design and foundry showcase at Sensors Expo 2011 includes:
Leading independent pure-play MEMS foundry on 150mm and 200mm wafers – Teledyne DALSA has extensive experience with advanced fabrication strategies and a profound understanding of the physics and materials science that make MEMS possible.
Teledyne DALSA’s MEMS process module portfolio on 150mm and 200mm wafers is recognized as exceptional and represents true competitive advantage for manufacturing of MEMS micro-mirrors and other optical MEMS applications.
HV ASIC design – Teledyne DALSA also offers industry-leading manufacturing capability and design support for high voltage CMOS ICs such as drivers for micro-mirrors, inkjet print heads, flat panel displays, LEDs and LCDs, and microfluidics.
In fact, Teledyne DALSA’s custom HV ASIC design service can build complete application-specific solutions from the ground up with none of the compromises of off-the-shelf components.
Customer interaction/business partnerships – Teledyne DALSA’s technology portfolio, together with excellence in planning, quality assurance, and customer interaction, deliver highly productive relationships with both customers and business partners.