Monday, July 11, 2011

Advantest to feature new SoC and NAND test solutions

SEMICON West 2011, SANTA CLARA, USA: Advantest Corp. will showcase the latest additions to its portfolio of IC test solutions during SEMICON West 2011, July 12-14.

The company will feature products and solutions that help to lower the cost of test and boost productivity for a variety of SOC applications, including an Enhanced Performance Package (EPP) for multi-functional ICs such as those used in mobile devices, and an Integrated Power Solution (IPS) for power ICs used in automotive and consumer electronics.

Advantest will also introduce two new solutions that together offer total test support for next-generation, high-efficiency, high-speed NAND flash memory devices, from front to back end. The company’s T5773 is a high-parallel, high-efficiency NAND flash package tester, and the new HA5100CELL, is a new one-touch, 4 wafer parallel test solution for NAND flash wafer test. These solutions and more will be displayed in booth 6665, at Moscone Center’s North Hall.

Keith Lee, president and CEO of Advantest America, commented: “To keep pace with the downward pricing pressures that define the current market environment, our customers are calling for lower cost, but reliable, high-volume test solutions for devices that are both complex and dense. We are pleased to be able to continue our long history of delivering technically superior test solutions, and understand that in today’s fab flow, particularly with increasing semiconductor varieties and complexities, the ability to test and know the integrity of devices in a production environment is critical. We stay committed to providing our customers a competitive cost of ownership through innovative technology, reliability and cost-effective test solutions.”

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