SAN JOSE, USA: Tessera Technologies Inc. congratulates Thomas DiStefano, John W. Smith, Jr. and Michael Warner on being named the recipients of the 2010 SEMI Award for North America for their contributions to Tessera chip-scale packaging (CSP) technology.
SEMI recognized DiStefano, Smith and Warner for their significant work to develop and commercialize Tessera’s μBGA® technology, which has been widely adopted for high-volume memory and logic devices.
“We are pleased that SEMI has chosen to recognize these three pioneers for their innovative contributions to the electronics industry,” said Henry R. Nothhaft, chairman and chief executive, Tessera. “Our CSP technology removes semiconductor package size limitations, transforming electronics by reducing overall product dimensions, improving performance, and enabling new levels of integration and miniaturization in portable electronics.”
Wednesday, January 12, 2011
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