WOBURN, USA: EPIC Technologies Inc., a leading innovator of ChipsFirst semiconductor packaging technology, announced that EPIC and Freescale have entered into agreements to settle pending litigation that EPIC had brought against Freescale.
Under the parties’ confidential agreements, Freescale and EPIC have licensed each other’s patents, and Freescale has taken a license to EPIC’s ChipsFirst know-how. In addition, to facilitate widespread adoption of EPIC’s ChipsFirst technology and Freescale’s Redistributed Chip Packaging (RCP) technology, EPIC and Freescale have agreed to enable a combined patent licensing approach for semiconductor packaging subcontractors.
Under this approach, semiconductor packaging subcontractors can obtain through EPIC license rights to both EPIC’s ChipsFirst and Freescale’s RCP patents. EPIC's ChipsFirst technology may also be independently and exclusively licensed from EPIC.
Freescale’s RCP and EPIC’s ChipsFirst technologies are each covered by product and process patents, as well as several pending patent applications. The technologies are designed for use in rigorous and demanding semiconductor packaging applications.
EPIC’s CEO, James Kohl, commented, “We are pleased to have resolved this litigation, and we look forward to further licensing activity in the coming months."
Monday, February 1, 2010
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